JPH06851Y2 - セラミック多層配線基板 - Google Patents
セラミック多層配線基板Info
- Publication number
- JPH06851Y2 JPH06851Y2 JP1987183265U JP18326587U JPH06851Y2 JP H06851 Y2 JPH06851 Y2 JP H06851Y2 JP 1987183265 U JP1987183265 U JP 1987183265U JP 18326587 U JP18326587 U JP 18326587U JP H06851 Y2 JPH06851 Y2 JP H06851Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- multilayer wiring
- ceramic
- conductive film
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title claims description 41
- 239000004020 conductor Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 description 8
- 230000032798 delamination Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000010344 co-firing Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987183265U JPH06851Y2 (ja) | 1987-11-30 | 1987-11-30 | セラミック多層配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987183265U JPH06851Y2 (ja) | 1987-11-30 | 1987-11-30 | セラミック多層配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0186273U JPH0186273U (en]) | 1989-06-07 |
JPH06851Y2 true JPH06851Y2 (ja) | 1994-01-05 |
Family
ID=31474694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987183265U Expired - Lifetime JPH06851Y2 (ja) | 1987-11-30 | 1987-11-30 | セラミック多層配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06851Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61270897A (ja) * | 1985-05-25 | 1986-12-01 | 株式会社住友金属セラミックス | 多層回路基板 |
-
1987
- 1987-11-30 JP JP1987183265U patent/JPH06851Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0186273U (en]) | 1989-06-07 |
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